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SAE ARP6537

Current Revision

Risk Mitigation for Pb-Free Solders Used Internally to Parts

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This document provides risk mitigation for Pb-free solders used internal to parts used in Aerospace and Defense applications. It will include mitigations applicable to encapsulated and cavity devices as the needs arise in industry. Currently this revision only addresses devices with encapsulation or underfill. Mitigations for open cavity devices are still being discussed, and will be addressed in future revisions. Microbumps with Thermal Compression Bonding (TCB) are not addressed by the mitigations in this document. The use of Pb-free microbumps with TCB are considered out of scope at this time. It is expected that this document will be primarily used by Control Levels 3 and 2C (as defined in GEIA-STD-0005-2 for programs that do not allow use of Pb-free tin or only allow its use on an exception basis). It may be used by other levels, or by applications not using GEIA-STD-0005-2.

SDO SAE: SAE International
Document Number ARP6537
Publication Date Oct. 19, 2020
Language en - English
Page Count 8
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Oct. 19, 2020 ARP6537 Revision