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ISO 9453:2020

Current Revision

Soft solder alloys - Chemical compositions and forms

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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.


SDO ISO: International Organization for Standardization
Document Number ISO 9453
Publication Date Not Available
Language en - English
Page Count
Revision Level
Supercedes
Committee ISO/TC 44/SC 12
Publish Date Document Id Type View
Not Available ISO 9453:2020 Revision