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IPC SMC-WP-003

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Chip Mounting Technology

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Chip Mounting Technology
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John Biancini, Intercon Corporation. Released by the Surface Mount Council.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 3
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available SMC-WP-003 Revision