Logo

IPC J-STD-027

Current Revision

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

$103.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Document Preview Not Available...

Mechanical Outline Standard for Flip Chip and Chip Size Configurations
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J027
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available J-STD-027 Revision