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IPC J-STD-013

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Implementation of Ball Grid Array & Other High Density Technology

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Implementation of Ball Grid Array & Other High Density Technology
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996. Equivalent to IEC Publicly Available Standard (PAS) 62085

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J013
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available J-STD-013 Revision