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IPC-TR-485

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Results of Copper Foil Rupture Strength Test Round Robin Study

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Results of Copper Foil Rupture Strength Test Round Robin Study
Results of Copper Foil Rupture Strength Test Round Robin Study

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number TR485
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-TR-485 Revision