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IPC-TR-470

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Thermal Characteristics of Multilayer Interconnection Boards

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Thermal Characteristics of Multilayer Interconnection Boards
Thermal Characteristics of Multilayer Interconnection Boards

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number TR470
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-TR-470 Revision