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IPC-TM-650 2.4.34.2

Current Revision

Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)

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Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number IPCTM
Publication Date Not Available
Language en - English
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Revision Level
Supercedes
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Publish Date Document Id Type View
Not Available IPC-TM-650 2.4.34.2 Revision