Logo

IPC-TM-650 2.4.24.4

Current Revision

Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias - DMA Method

$0.00

$0.00

$0.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Document Preview Not Available...

Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias - DMA Method
Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias - DMA Method

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number IPCTM
Publication Date Not Available
Language en - English
Page Count
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-TM-650 2.4.24.4 Revision