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IPC-T-50N

Historical Revision

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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电子电路互连与封装术语及定义
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语,以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语,包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number T50
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level N
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-T-50N Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50K Revision
Not Available IPC-T-50J Revision
Not Available IPC-T-50H Revision
Not Available IPC-T-50G Revision
Not Available IPC-T-50N Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50K Revision
Not Available IPC-T-50H Revision