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IPC-T-50M

Historical Revision

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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Terms and Definitions for Interconnecting and Packaging Electronic Circuits
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology. Also includes commonly used industry acronyms.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number T50
Publication Date Not Available
Language en - English
Page Count
Revision Level M
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-T-50N Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50K Revision
Not Available IPC-T-50J Revision
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Not Available IPC-T-50G Revision
Not Available IPC-T-50N Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50K Revision
Not Available IPC-T-50H Revision