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IPC-T-50J

Historical Revision

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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SUPERSEDED BY T-50K
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms. 121 pages. Released 2011.Included in Collections C-102, C-103, C-105, C-106, C-107, C-108 and C-1000

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number T50
Publication Date Not Available
Language en - English
Page Count
Revision Level J
Supercedes
Committee
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