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IPC-T-50H

Historical Revision

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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电子电路互连与封装术语及定义
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语,新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引,以便于查找。全文276页,于 2008年7月公布。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number T50
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level H
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-T-50N Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50K Revision
Not Available IPC-T-50J Revision
Not Available IPC-T-50H Revision
Not Available IPC-T-50G Revision
Not Available IPC-T-50N Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50M Revision
Not Available IPC-T-50K Revision
Not Available IPC-T-50H Revision