Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering, dewetting, board fabrication processes and testing
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | T50 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | N |
Supercedes | |
Committee |