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IPC-SM-780

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Component Packaging & Interconnecting with Emphasis on Surface Mounting

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Component Packaging & Interconnecting with Emphasis on Surface Mounting
This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information. 138 pages. Released March 1988.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number SM780
Publication Date Not Available
Language en - English
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Not Available IPC-SM-780 Revision