Logo

IPC-PE-740A

Current Revision

Troubleshooting for Printed Board Manufacture and Assembly

$183.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Stay effortlessly up-to-date with the latest standard revisions. When new versions are released, they're automatically charged and delivered to you, ensuring seamless compliance.

Document Preview Not Available...

Troubleshooting for Printed Board Manufacture and Assembly
This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole preparation, plated-through hole, cleaning procedures, imaging, electroplating, etching, innerlayer fabrication lamination, soldering, metallic protective coatings, non-metallic protective coatings, component preparation and assembly, inspection and test, and rework and repair. This revision features an expanded assembly chapter that includes soldering, cleaning and post soldering process. Also new to this revision are examples of additional processes for troubleshooting. And, as an enhancement, an easy-to-use index has been added to help you find your process problem. 388 pages. Released December 1997.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number PE740
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-PE-740A Revision