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IPC-MC-790

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Guidelines for Multichip Module Technology Utilization

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Guidelines for Multichip Module Technology Utilization - Single User Download
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number MC790
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-MC-790 Revision