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IPC-L-115B

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Specification for Rigid Metal Clad Base Materials for Printed Boards

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Specification for Rigid Metal Clad Base Materials for Printed Boards
Specification for Rigid Metal Clad Base Materials for Printed Boards

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number L115
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-L-115B Revision