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IPC/JEDEC-J-STD-609B

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Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes

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Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:

  1. those assemblies that are assembled with lead-containing or lead-free solder;
  2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials;
  3. the maximum component temperature not to be exceeded during assembly or rework processing;
  4. the base materials used in the PCB construction, including those PCBs that use halogen-free resin;
  5. the surface finish of PCBs; and
  6. the conformal coating on PCBAs.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J609
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC/JEDEC-J-STD-609B Revision
Not Available IPC/JEDEC J-STD-609A Revision
Not Available IPC/JEDEC J-STD-609 Revision
Not Available IPC/JEDEC-J-STD-609A Revision