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IPC/JEDEC-J-STD-033D

Historical Revision

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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$145.60


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潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用
本文件的目的是,针对潮湿、再流焊和工艺敏感器件,向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在再流焊温度下造成的封装损伤,这些损伤会导致合格率和可靠性的降低。一旦正确执行IPC/JEDEC J-STD-033D,这些工艺可以提供从密封时间算起12个月的最短保质期。由IPC和JEDEC开发。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J033
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC/JEDEC J-STD-033D Revision
Not Available IPC/JEDEC J-STD-033C Revision
Not Available IPC/JEDEC J-STD-033B Revision
Not Available IPC/JEDEC J-STD-033A Revision
Not Available IPC/JEDEC J-STD-033 Revision
Not Available IPC/JEDEC-J-STD-033C-1 Consolidated
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision