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IPC/JEDEC J-STD-033D

Current Revision

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J033
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC/JEDEC J-STD-033D Revision
Not Available IPC/JEDEC J-STD-033C Revision
Not Available IPC/JEDEC J-STD-033B Revision
Not Available IPC/JEDEC J-STD-033A Revision
Not Available IPC/JEDEC J-STD-033 Revision
Not Available IPC/JEDEC-J-STD-033C-1 Consolidated
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision