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IPC/JEDEC-J-STD-020D

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Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

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IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This is the German Language version of IPC-J-STD-020D.Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC. 13 pages. Released June 2007

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J020
Publication Date Not Available
Language de - German
Page Count
Revision Level D
Supercedes
Committee
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Not Available IPC/JEDEC-J-STD-020F Revision
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Not Available IPC/JEDEC-J-STD-020D-1 Consolidated