IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This is the German Language version of IPC-J-STD-020D.Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC. 13 pages. Released June 2007
| SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
| Document Number | J020 |
| Publication Date | Not Available |
| Language | de - German |
| Page Count | |
| Revision Level | D |
| Supercedes | |
| Committee |