Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - AM1
              
              The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy   standards.  The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation.  Finally, the IPC-J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the IPC J-STD-006C standard. 
              
              
              
            
| SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits | 
| Document Number | J006 | 
| Publication Date | Not Available | 
| Language | en - English | 
| Page Count | |
| Revision Level | C | 
| Supercedes | |
| Committee |