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IPC-J-STD-006C

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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering PastesThis "C" revision has been updated to address intentional additions to a solder alloy and impurities in the alloy. In addition, the tables and appendices have been updated with the latest alloy information. 22 pages. Released July 2013.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J006
Publication Date Not Available
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B Revision
Not Available IPC-J-006A Revision
Not Available IPC J-STD-006 Revision
Not Available IPC J-STD-006B WAM 1 Consolidated
Not Available IPC-J-STD-006B-WAM1,2 Consolidated
Not Available IPC-J-STD-006C Revision
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B CN Revision
Not Available IPC J-STD-006B RU Revision
Not Available IPC-J-STD-006B Revision
Not Available IPC-J-STD-006B-WAM1,2 Consolidated