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IPC-J-STD-006B

Historical Revision

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This is the Japanese language version of J-STD-006B.This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ''special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry: IPC/EIA J-STD-004, Requirements for Soldering Fluxes; IPC/EIA J-STD-005, Requirements for Soldering Pastes; IPC J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. 27 pages. Released January 2006.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J006
Publication Date Not Available
Language ja - Japanese
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B Revision
Not Available IPC-J-006A Revision
Not Available IPC J-STD-006 Revision
Not Available IPC J-STD-006B WAM 1 Consolidated
Not Available IPC-J-STD-006B-WAM1,2 Consolidated
Not Available IPC-J-STD-006C Revision
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B CN Revision
Not Available IPC J-STD-006B RU Revision
Not Available IPC-J-STD-006B Revision
Not Available IPC-J-STD-006B-WAM1,2 Consolidated