Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
              
              This is the Japanese language version of J-STD-006B.This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ''special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry: IPC/EIA J-STD-004, Requirements for Soldering Fluxes; IPC/EIA J-STD-005, Requirements for Soldering Pastes; IPC J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. 27 pages. Released January 2006.
              
              
              
            
| SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits | 
| Document Number | J006 | 
| Publication Date | Not Available | 
| Language | ja - Japanese | 
| Page Count | |
| Revision Level | B | 
| Supercedes | |
| Committee |