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IPC J-STD-006B CN

Historical Revision

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

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电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求
电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J006
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B Revision
Not Available IPC-J-006A Revision
Not Available IPC J-STD-006 Revision
Not Available IPC J-STD-006B WAM 1 Consolidated
Not Available IPC-J-STD-006B-WAM1,2 Consolidated
Not Available IPC-J-STD-006C Revision
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B CN Revision
Not Available IPC J-STD-006B RU Revision
Not Available IPC-J-STD-006B Revision
Not Available IPC-J-STD-006B-WAM1,2 Consolidated