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IPC-J-STD-005A

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Requirements for Solder Pastes

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焊膏要求
简要介绍 (英文)本标准列出了焊膏鉴定、特征描述的要求。本标准参考了有关金属含量、粘度、塌落、焊料球、粘附力、润湿等的测试方法及标准。IPC-HDBK-005 焊膏评估指南(不包含在本标准的购买中)提供了更多的支持。取代J-STD-005。共10页。于2012年2月发布。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J005
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-005B Revision
Not Available IPC-J-STD-005A Revision
Not Available IPC J-STD-005 Revision
Not Available IPC-J-STD-005A Revision
Not Available IPC J-STD-005A RU Revision
Not Available IPC-J-STD-005A Revision
Not Available IPC J-STD-005 CN Revision
Not Available IPC-J-STD-005 Revision
Not Available IPC-J-STD-005-WAM1 Consolidated