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IPC-J-STD-005-WAM1

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Requirements for Solder Pastes

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Requirements for Soldering Pastes - includes Amendment 1
This is the Chinese language version of J-STD-005.DOD Adopted 1995Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J005
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-005B Revision
Not Available IPC-J-STD-005A Revision
Not Available IPC J-STD-005 Revision
Not Available IPC-J-STD-005A Revision
Not Available IPC J-STD-005A RU Revision
Not Available IPC-J-STD-005A Revision
Not Available IPC J-STD-005 CN Revision
Not Available IPC-J-STD-005 Revision
Not Available IPC-J-STD-005-WAM1 Consolidated