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IPC-J-STD-003D

Historical Revision

Solderability Tests for Printed Boards

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印制板可焊性测试
IPC J-STD-003D标准描述了用于验证印制板制造过程和随后的存储对拟焊接的印制板部分的可焊性没有不利影的可焊性测定。可焊性是通过对测试样品的评估来确定的,该样品为整板中的一部分,随后按所选的测试方法取出该部分进行测试。IPC J-STD-003D提供的可焊性测试方法,以确定印制板表面导体,连接盘和镀通孔是否容易被焊料润湿,并能承受印制板组装过程的严格要求。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J003
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-003D Revision
Not Available IPC-J-STD-003C Revision
Not Available IPC-J-STD-003B Revision
Not Available IPC J-STD-003A Revision
Not Available IPC J-STD-003 Revision
Not Available IPC-J-STD-003D Revision
Not Available IPC-J-STD-003B Revision
Not Available IPC-J-STD-003C-WAM1&2-JP Consolidated
Not Available IPC-J-STD-003C-WAM1 Consolidated