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IPC-J-STD-003C-WAM1

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Solderability Tests for Printed Boards

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印制板可焊性测试
J-STD-003C规定了用于评估印制板表面导体、连接盘和镀覆孔可焊性的测试方法和缺陷定义,并附有相关的图表。本标准适用于供应商和用户。本标准所规定的可焊性测试方法的目标是确定印制板表面导体、连接盘及镀覆孔被焊料润湿的难易程度和经受苛刻的印制板组装工艺的能力。描述了评定表面导体、连接盘和镀覆孔可焊性所采用的测试方法。C版本包含了可焊性量具可再现性和可重复性的最新信息,同时更新了插图 修订本1纠正了编辑错误并在文档许多地方增加了澄清声明。全文共27页,2014年发布。2015年11月

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J003
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-003D Revision
Not Available IPC-J-STD-003C Revision
Not Available IPC-J-STD-003B Revision
Not Available IPC J-STD-003A Revision
Not Available IPC J-STD-003 Revision
Not Available IPC-J-STD-003D Revision
Not Available IPC-J-STD-003B Revision
Not Available IPC-J-STD-003C-WAM1&2-JP Consolidated
Not Available IPC-J-STD-003C-WAM1 Consolidated