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IPC-J-STD-003D

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Solderability Tests for Printed Boards

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Solderability Tests for Printed Boards
The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected. IPC J-STD-003D provides solderability test methods to determine the acceptance of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder, and to withstand the rigors of the printed board assembly processes.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J003
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-003D Revision
Not Available IPC-J-STD-003C Revision
Not Available IPC-J-STD-003B Revision
Not Available IPC J-STD-003A Revision
Not Available IPC J-STD-003 Revision
Not Available IPC-J-STD-003D Revision
Not Available IPC-J-STD-003B Revision
Not Available IPC-J-STD-003C-WAM1&2-JP Consolidated
Not Available IPC-J-STD-003C-WAM1 Consolidated