Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
This is an amendment to IPC J-STD-001F, a recognized industry-consensus standard covering materials and processes. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements and BGA voiding criteria, new graphics for several surface mount component types, revised staking criteria, and recognition of the paragraphs addressed in J-STD-001FS, Space Applications Electronic Hardware Addendum to J-STD-001F.This amendment must be used with J-STD-001F. See related items.
| SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
| Document Number | J001 |
| Publication Date | Not Available |
| Language | en - English |
| Page Count | |
| Revision Level | F |
| Supercedes | |
| Committee |