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IPC-HM-860

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Specification for Multilayer Hybrid Circuits

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Specification for Multilayer Hybrid Circuits
Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number HM860
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-HM-860 Revision