Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating proper assemblies and bare printed boards. 28 pages. Released 2014.
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | FC234 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | A |
Supercedes | |
Committee |