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IPC-CI-408

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Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number CI408
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-CI-408 Revision