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IPC-CF-152B

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Composite Metallic Materials Specification for Printed Wiring Boards

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Composite Metallic Materials Specification for Printed Wiring Boards
Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number CF152
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-CF-152B Revision
Not Available IPC-CF-152A Revision