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IPC/JEDEC-9703

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IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests. 42 pages. Released March 2009.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9703
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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