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IPC-9702

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Monotonic Bend Characterization of Board-Level Interconnects

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板极互连的单向弯曲特性描述
本文件旨在描述元器件板级互连的断裂强度特性,它详细说明了确定板级器件互连对非周期板组装和测试操作过程中可能发生的弯曲载荷的抗断裂力的常用方法。本文件适用于采用常规再流焊接技术连接到印制板上的表面贴装元器件,并补充了有关运输、装卸或现场操作过程中的机械冲击或撞击的现有标准。全文共14页,2004年6月正式发布英文版,2011年6月发布中文版 预览本标准

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9702
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level 0
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Committee
Publish Date Document Id Type View
Not Available IPC-9702-WAM1 Consolidated
Not Available IPC-9702 Revision