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IPC-9701A

Historical Revision

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

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Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints. 24 pages. Released February 2006.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9701
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-9701B Revision
Not Available IPC-9701A Revision
Not Available IPC-9701 Revision
Not Available IPC-9701A-CN Revision