Logo

IPC-9701B

Current Revision

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

$103.00

$121.00

$145.60


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Document Preview Not Available...

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9701
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-9701B Revision
Not Available IPC-9701A Revision
Not Available IPC-9701 Revision
Not Available IPC-9701A-CN Revision