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IPC-9631

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User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment. 11pages. Released December 2010.Included in the C-1000 Collections.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9631
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-9631 Revision