PWB Assembly Soldering Process Guideline for Electronic Components
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | 9502 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | 0 |
Supercedes | |
Committee |