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IPC-9502

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PWB Assembly Soldering Process Guideline for Electronic Components

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PWB Assembly Soldering Process Guideline for Electronic Components
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9502
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-9502 Revision