Logo

IPC-9502

Current Revision

PWB Assembly Soldering Process Guideline for Electronic Components

$103.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Document Preview Not Available...

PWB Assembly Soldering Process Guideline for Electronic Components
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9502
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-9502 Revision