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IPC-9501

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PWB Assembly Process Simulation for Evaluation of Electronic Components

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PWB Assembly Process Simulation for Evaluation of Electronic Components
Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9501
Publication Date Not Available
Language en - English
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Revision Level 0
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