Guidelines for Microsection Preparation
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | 9241 |
Publication Date | Not Available |
Language | en - English |
Page Count | |
Revision Level | 0 |
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Committee |