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IPC-9111

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Troubleshooting for Printed Board Assembly Processes

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印制电路板组装工艺的故障排除
本标准以故障排除示例、工艺因果信息和统计方法的形式提供指导,以纠正与印制线路产品的设计、制造、组装和测试相关的所有领域的问题。整个文档中都提供了照片以帮助读者。 IPC-9111取代IPC-PE-740A关于印制电路板组件部分内容。 2019年1月发布,2019年8月完成汉化

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9111
Publication Date Not Available
Language zh - Chinese
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Revision Level 0
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