Logo

IPC-D-859

Current Revision

Design Standard for Thick Film Multilayer Hybrid Circuits

$143.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


Stay effortlessly up-to-date with the latest standard revisions. When new versions are released, they're automatically charged and delivered to you, ensuring seamless compliance.

Document Preview Not Available...

Design Standard for Thick Film Multilayer Hybrid Circuits
This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages. Released December 1989.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number D859
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-D-859 Revision