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IPC-7711/21D

Current Revision

Rework, Modification and Repair of Electronic Assemblies Redline

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Rework, Modification and Repair of Electronic Assemblies
The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 771121
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
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