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IPC-7711/21C

Historical Revision

Rework, Modification and Repair of Electronic Assemblies Redline

$552.00

$684.00

$803.40

Modifications (Amendments, Corrigenda, Errata, etc.)

$33.00

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$46.80


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電子組件的返工、修改和維修
本指南提供了印刷電路板組件的返工,維修和修改程序。 本次修訂包括以前作為修訂本發布的程序,基本信息和通用程序部分的更新,使用具有預熱功能的聚焦紅外返工系統的BGA新程序,和所有其他程序的一般更新。許多規程包含彩色插圖。全文超過300頁。於2017年1月正式發布。2017年5月翻譯。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 771121
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level C
Supercedes
Committee
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