Rework and Repair Guide
This is the Polish language version of IPC-7711/21A. IPC-7711A, Rework of Electronic Assemblies (with Change 1) and IPC-7721A, Repair and Modification of Printed Boards and Electronic Assemblies (with Changes 1 and 2) now includes additional support for BGAs and flex-print repair. IPC-7711A includes procedural requirements, tools, materials and methods to be used in removing and replacing conformal coatings, surface mount and through-hole components. IPC-7721A includes procedures for repairing, modifying and reworking boards and assemblies. Full color illustrations help the reader make use of the materials. Supersedes IPC-7711, IPC-7721 and IPC-R-700.
SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
Document Number | 771121 |
Publication Date | Not Available |
Language | pl - Polish |
Page Count | |
Revision Level | A |
Supercedes | |
Committee |