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IPC-7711/21A

Historical Revision

Rework, Modification and Repair of Electronic Assemblies Redline

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Rework and Repair Guide
This is the Polish language version of IPC-7711/21A. IPC-7711A, Rework of Electronic Assemblies (with Change 1) and IPC-7721A, Repair and Modification of Printed Boards and Electronic Assemblies (with Changes 1 and 2) now includes additional support for BGAs and flex-print repair. IPC-7711A includes procedural requirements, tools, materials and methods to be used in removing and replacing conformal coatings, surface mount and through-hole components. IPC-7721A includes procedures for repairing, modifying and reworking boards and assemblies. Full color illustrations help the reader make use of the materials. Supersedes IPC-7711, IPC-7721 and IPC-R-700.

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 771121
Publication Date Not Available
Language pl - Polish
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7711/21D Revision
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Not Available IPC-7711/21A Revision