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IPC-7530A

Historical Revision

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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群焊工艺温度曲线指南(再流焊和波峰焊
本标准的目的是为开发温度曲线提供有效和实用的信息,以生产可接受的锡铅和无铅的电子组件。该修订版将原来标准的重点从再流温度曲线扩展到包括激光焊曲线、选择焊曲线、波峰焊曲线或其他焊接曲线。该修订版还包括一个全彩色故障排除指南,用于解决可归因于分析的常见缺陷。

SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7530
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7530A Revision
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